Based on TI's CC2560 Bluetooth core IC, PAN1315 measures 6.5 x 9 x 1.7 mm and accommodates PCB pad pitch of 1.3 mm and as little as 2 layers. Design is 100% pin-compatible with next-gen Bluetooth low energy devices, and facilitates connectivity between mobile devices and small button cell battery-powered devices to create data chain from sensors to Web. Host Controlled Interface (HCI) supports ...
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